• DocumentCode
    1292954
  • Title

    Hybrid analysis of three-dimensional MMIC elements by the method of lines

  • Author

    Vietzorreck, Larissa ; Pregla, Reinhold

  • Author_Institution
    Dept. of Electr. Eng., Fern Univ., Hagen, Germany
  • Volume
    44
  • Issue
    12
  • fYear
    1996
  • fDate
    12/1/1996 12:00:00 AM
  • Firstpage
    2580
  • Lastpage
    2586
  • Abstract
    A new eigenmode algorithm, based on the method of lines, is presented for full-wave analysis of real three-dimensional (3-D) MMIC elements. Finite conductor thickness, finite substrate, dielectric or ohmic losses are rigorously modeled. The analytical calculation In the direction of propagation enables the analysis of structures with very short or long interconnections between the single discontinuities. To demonstrate the generality of the proposed algorithm several completely different structures were analyzed. Examinations of the convergence were performed. Scattering parameters of filters and planar transmission line interconnects like air bridges, via holes and bead transitions were investigated. The calculated results agree very well with computed and measured results published in literature
  • Keywords
    MMIC; S-parameters; convergence of numerical methods; eigenvalues and eigenfunctions; losses; transmission line theory; 3D MMIC elements; air bridges; bead transitions; convergence; dielectric losses; eigenmode algorithm; filters; finite conductor thickness; finite substrate; full-wave analysis; hybrid analysis; method of lines; ohmic losses; planar transmission line interconnects; scattering parameters; three-dimensional MMIC elements; via holes; Algorithm design and analysis; Conductors; Convergence; Dielectric losses; Dielectric substrates; Filters; MMICs; Planar transmission lines; Scattering parameters; Transmission line discontinuities;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.554607
  • Filename
    554607