DocumentCode :
129368
Title :
Lamb-wave resonator for microphone application
Author :
Meltaus, Johanna ; Ylilammi, Markku ; Dekker, James ; Riekkinen, Tommi ; Rantakari, Pekka ; Nurmela, Arto ; Pensala, Tuomas ; Harrington, Brandon P. ; Lautenschlager, Eric
Author_Institution :
VTT Tech. Res. Centre of Finland, Espoo, Finland
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
388
Lastpage :
391
Abstract :
We study the pressure sensitivity of AlN thin-film resonators on a poly-Si membrane sublayer. The studied resonators operate on the S0-mode Lamb wave at 750 MHz. The resonators are fabricated on a released membrane which consists of a polysilicon sublayer, molybdenum electrodes, and AlN as the piezoelectric layer. Operation of the test structures is simulated using 2D and 3D finite element method models. Simulated pressure sensitivity at pressures below 1 Pa is 0.035 ppm/Pa. Pressure sensitivity of the fabricated test devices was measured by probing the devices on-wafer and measuring their electric frequency response while applying a variable differential pressure over the wafer. To remove the noise and the outliers, the data was filtered with a 3-point median filter prior to analysis. The linearized pressure sensitivity of frequency below 1 Pa is around 1 ppm/Pa. With minimized residual stress, optimal materials and modified membrane design, the pressure sensitivity can be improved.
Keywords :
III-V semiconductors; aluminium compounds; electrodes; finite element analysis; frequency response; internal stresses; microphones; semiconductor thin films; surface acoustic wave resonators; thin film devices; wide band gap semiconductors; 2D finite element method models; 3D finite element method models; AlN; Lamb-wave resonator; Si; frequency 750 MHz; linearized pressure sensitivity; microphone; molybdenum electrodes; noise; piezoelectric layer; polysilicon membrane sublayer; pressure sensitivity electric frequency response; residual stress; thin-film resonators; three-point median filter; variable differential pressure; Electrodes; Frequency measurement; III-V semiconductor materials; Load modeling; Pressure measurement; Resonant frequency; Sensitivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0096
Filename :
6931923
Link To Document :
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