DocumentCode :
1293742
Title :
Determination of key parameters for SEU occurrence using 3-D full cell SRAM simulations
Author :
Roche, Ph. ; Palau, J.-M. ; Bruguier, G. ; Tavernier, C. ; Ecoffet, R. ; Gasiot, J.
Author_Institution :
CEM2, Univ. des Sci. et Tech. du Languedoc, Montpellier, France
Volume :
46
Issue :
6
fYear :
1999
Firstpage :
1354
Lastpage :
1362
Abstract :
A 3-D entire SRAM cell, based on a 0.35-/spl mu/m current CMOS technology, is simulated in this work with a DEVICE simulator. The transient current, resulting from a heavy ion strike in the most sensitive region of the cell, is studied as a function of the LET value, the cell layout and the ion penetration depth. A definition of the critical charge is proposed and two new methods are presented to compute this basic amount of charge only using SPICE simulations. Numerical applications are performed with two different generations of submicron CMOS technologies, including the determination of the sensitive thicknesses.
Keywords :
CMOS memory circuits; SPICE; SRAM chips; cellular arrays; circuit simulation; ion beam effects; 0.35 micron; 3D full cell SRAM simulations; CMOS technology; DEVICE simulator; LET value; SEU occurrence; SPICE simulations; cell layout; heavy ion strike; ion penetration depth; sensitive thicknesses; transient current; CMOS process; CMOS technology; Circuit simulation; Computational modeling; Predictive models; Process design; Random access memory; SPICE; Semiconductor device modeling; Semiconductor process modeling;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.819093
Filename :
819093
Link To Document :
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