Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

Author

Kim, Jingook ; Ren, Liehui ; Fan, Jun

Author_Institution

Missouri S&T Electromagn. Compatibility Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA

Volume

58

Issue

9

fYear

2010

Firstpage

2434

Lastpage

2447

Abstract

A systematic approach for inductance extraction for via arrays between two parallel planes is presented. Both self and mutual inductance values are obtained based on a cavity model. The physics associated with the via inductances is analyzed, and a rigorous method is developed to derive an equivalent total inductance for multiple via arrays. Analytical equations for the equivalent total inductance are derived in closed forms for simple cases. The proposed method is corroborated with measurements, and application of the method for power distribution network designs is demonstrated.

Keywords

equivalent circuits; integrated circuit design; cavity model; equivalent total inductance; mutual inductance values; parallel planes; physics-based inductance extraction; power distribution network design; self inductance values; via arrays; via inductance; Capacitors; Cavity resonators; Electromagnetic interference; High speed integrated circuits; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit layout; Integrated circuit modeling; Integrated circuit noise; Power systems; Resonant frequency; Voltage; Cavity model; decoupling capacitor; equivalent total inductance; integrated circuit (IC) pin layout; parallel planes; power distribution network (PDN); via inductance extraction;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2010.2058278

Filename

5546928