DocumentCode :
129403
Title :
Cross-correlation of specification and RTL for soft IP analysis
Author :
Singh, Bawa ; Shankar, Ashwin ; Wolff, Francis ; Papachristou, C. ; Weyer, Daniel ; Clay, Steve
Author_Institution :
Dept. of EECS, Case Western Reserve Univ., Cleveland, OH, USA
fYear :
2014
fDate :
24-28 March 2014
Firstpage :
1
Lastpage :
6
Abstract :
Semiconductor companies often use 3rd party IPs in order to improve their design productivity. In practice, there are risks involved in using a 3rd party IP as bugs may creep in due to versioning issues, poor documentation, and mismatches between specification and RTL. As a result of this, 3rd party IP specification and RTL must be carefully evaluated. Our methodology addresses this issue, which cross-correlates specification and RTL to discover these discrepancies. The key innovative ideas in our approach are to use prior and trusted experience about designs, which include their specs and RTL code. Also, we have captured this trusted experience into two knowledge bases (KB), Spec-KB and RTL-KB. Finally, knowledge base rules are used to cross-correlate the RTL blocks to the specs. We have tested our approach by analyzing several 3rd party IPs. We have defined metrics for specification coverage and RTL identification coverage to quantify our results.
Keywords :
formal specification; industrial property; integrated circuit design; system-on-chip; 3rd party IP specification; RTL code; RTL identification coverage; RTL-KB; SoC designs; knowledge base rules; semiconductor companies; soft IP analysis; spec-KB; specification cross-correlation; system on chip designs; IP networks; Knowledge based systems; Ontologies; Registers; Standards; System-on-chip; Vectors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location :
Dresden
Type :
conf
DOI :
10.7873/DATE.2014.303
Filename :
6800504
Link To Document :
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