Title :
Worst case total dose radiation response of 0.35 /spl mu/m SOI CMOSFETs
Author :
Liu, S.T. ; Balster, S. ; Sinha, S. ; Jenkins, W.C.
Author_Institution :
Solid State Electron. Center, Honeywell Inc., Plymouth, MN, USA
Abstract :
Through experimental results and analysis by TSUPREM4/MEDICI simulations, the worst case back gate total dose bias condition is established for body tied SOI NMOSFETs. Utilizing the worst-case bias condition, a recently proposed model that describes the back n-channel threshold voltage shift as a function of total dose, TSUPREM4/MEDICI simulations, and circuit level SPICE simulations, a methodology to model post-rad standby current is developed and presented. This methodology requires the extraction of fundamental starting material/material preparation constants, and then can be utilized to examine post-rad stand-by current at the device and circuit level as function of total dose. Good agreement between experimental results and simulations is demonstrated.
Keywords :
CMOS integrated circuits; MOSFET; digital simulation; electronic engineering computing; integrated circuit modelling; radiation effects; semiconductor device models; silicon-on-insulator; 0.35 micron; SOI CMOSFETs; Si; TSUPREM4/MEDICI simulations; back gate total dose bias condition; back n-channel threshold voltage shift; body tied SOI NMOSFETs; circuit level SPICE simulations; material preparation constants; model; post-rad standby current modelling; worst case total dose radiation response; CMOS technology; CMOSFETs; Circuit simulation; Computer aided software engineering; Laboratories; MOSFETs; SPICE; Semiconductor device modeling; Testing; Threshold voltage;
Journal_Title :
Nuclear Science, IEEE Transactions on