A MCM-D-type module for the ATLAS pixel detector

Author

Becks, K.-H. ; Beyne, E. ; Ehrmann, O. ; Gerlach, P. ; Gregor, I.M. ; Pieters, P. ; Topper, Michael ; Truzzi, C. ; Wolf, J.

Author_Institution

Dept. of Phys., Wuppertal Univ., Germany

Volume

46

Issue

6

fYear

1999

Firstpage

1861

Lastpage

1864

Abstract

For the ATLAS experiment at the planned Large Hadron Collider (LHC) at CERN hybrid pixel detectors are being built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm/spl times/60.4 mm, 16 read out ICs, each serving 24/spl times/160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dies are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.

Keywords

multichip modules; nuclear electronics; position sensitive particle detectors; readout electronics; silicon radiation detectors; 16.4 mm; 160 pixel; 24 pixel; 3840 pixel; 60.4 mm; ATLAS pixel detector; Large Hadron Collider; MCM-D-type module; flip-chip assembly; hybrid pixel detectors; inner tracking detector system; local signal interconnection; module controller chip; optical transceive; power distribution busses; prototype results; read out ICs; sensor tile; Assembly; Detectors; Large Hadron Collider; Optical control; Optical interconnections; Optical sensors; Power distribution; Power system interconnection; Tiles; Transceivers;

fLanguage

English

Journal_Title

Nuclear Science, IEEE Transactions on

Publisher

ieee

ISSN

0018-9499

Type

jour

DOI

10.1109/23.819241

Filename

819241