DocumentCode :
1294407
Title :
Contactless measurement of conductivity of metals and semiconductors and of plating thickness of sheet conductors
Author :
Olszewski, E.J. ; Cormack, G.D.
Author_Institution :
Carleton Univ., Ottawa, Ont., Canada
Issue :
3
fYear :
1976
Firstpage :
186
Lastpage :
190
Abstract :
Theory is developed and experimental data is presented for a noncontacting, nondestructive transient eddy current testing technique that can be used for conductivity measurements on flat surface samples over a range of at least 300<;σ<;6×107 mho/m. Furthermore, this technique is shown to be useable for measurement of the thickness of plating of electrically conductive material over the range of at least 0.1 μm<;x<;50 μm. The method is based on pulse excitation of a small coil above the sample. The pulser and display unit is a commercially available time-domain reflectometer.
Keywords :
eddy currents; electrical conductivity measurement; 300 to 6 x 107 mho/m; conductive plating thickness measurement; conductivity measurements; flat surface samples; metals; noncontacting measurement; nondestructive transient eddy current testing technique; plating thickness range 0.1 to 50 micron; semiconductors; time domain reflectometer; Coils; Conductivity; Impedance; Semiconductor device measurement; Substrates; Thickness measurement;
fLanguage :
English
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9456
Type :
jour
DOI :
10.1109/TIM.1976.6312343
Filename :
6312343
Link To Document :
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