Title :
Scenario-aware data placement and memory area allocation for Multi-Processor System-on-Chips with reconfigurable 3D-stacked SRAMs
Author :
Meng-Ling Tsai ; Yi-Jung Chen ; Yi-Ting Chen ; Ru-Hua Chang
Author_Institution :
Dept. of Comput. Sci. & Inf. Eng., Nat. Chi Nan Univ., Nantou, Taiwan
Abstract :
Integrating Multi-Processor System-on-Chips (MP-SoCs) with 3D-stacked reconfigurable SRAM tiles has been proposed for embedded systems with high memory demands. At runtime, the SRAM tiles are configured into several memory areas, which can be reconfigured according to the dynamic behavior of the system. Targeting this architecture, in this paper, we propose a data placement and memory area allocation algorithm. The goal of the proposed algorithm is to optimize the performance of the memory system by minimizing the on-chip memory access latency, the number of off-chip memory accesses, and the number of reconfigurations. Since the behavior of an embedded system can be described by a set of scenarios, where each scenario specifies a set of applications that would execute concurrently, the proposed algorithm synthesizes data placements and the memory area allocation for each scenario. Not only the data access patterns within the scenario but also among all scenarios are considered for data placement. We evaluate the proposed algorithm on a set of synthetic and real-world applications. The experimental results show that, compared to the existing data placement method designed for MPSoCs with distributed memory modules, the proposed algorithm achieves up to 11.72% of data access latency reduction.
Keywords :
SRAM chips; distributed memory systems; embedded systems; system-on-chip; 3D-stacked reconfigurable SRAM tiles; MP-SoCs; distributed memory modules; embedded systems; memory area allocation algorithm; multiprocessor system-on-chips; off-chip memory accesses; on-chip memory access latency; scenario-aware data placement; Algorithm design and analysis; IP networks; Interference; Random access memory; Resource management; System-on-chip; Tiles;
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location :
Dresden
DOI :
10.7873/DATE.2014.336