DocumentCode :
1294962
Title :
On the design of coplanar bond wires as transmission lines
Author :
Goossen, K.W.
Author_Institution :
Bell Labs., Lucent Technol., Holmdel, NJ, USA
Volume :
9
Issue :
12
fYear :
1999
fDate :
12/1/1999 12:00:00 AM
Firstpage :
511
Lastpage :
513
Abstract :
Bond wires are typically thought of as lumped electrical parasitic elements, and the usual design methodology is to make them as short as possible. Here, another scenario is shown where the bond wires may be thought of as transmission lines. Specifically, the practical system of “coplanar waveguide wires” is analyzed. If parameters are chosen carefully, especially with regard to wire height above substrate, they may impedance match the microstrip connector
Keywords :
coplanar transmission lines; impedance matching; lead bonding; microwave devices; packaging; transmission line theory; CPW wires; coplanar bond wire design; coplanar waveguide wires; impedance matching; microwave package; transmission lines; wire height above substrate; Bonding; Coaxial components; Connectors; Coplanar transmission lines; Dielectric substrates; Impedance; Microstrip; Packaging; Transmission lines; Wires;
fLanguage :
English
Journal_Title :
Microwave and Guided Wave Letters, IEEE
Publisher :
ieee
ISSN :
1051-8207
Type :
jour
DOI :
10.1109/75.819415
Filename :
819415
Link To Document :
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