Title :
3D FPGA using high-density interconnect Monolithic Integration
Author :
Turkyilmaz, O. ; Cibrario, G. ; Rozeau, O. ; Batude, P. ; Clermidy, F.
Author_Institution :
CEA - LETI, Grenoble, France
Abstract :
New 3D technology, called “Monolithic Integration”, offers very dense 3D interconnect capabilities. In this paper, we propose a 3D FPGA architecture with logic-on-memory approach based on this technology. The routing and computation blocks are splitted into two layers where the logic is placed on the top and memory on the bottom. Using extracted values from layout in 14nm FDSOI technology, typical benchmark circuits are evaluated in the VPR5 toolflow. The results show an area reduction of 55% compared to the 2D FPGA. More importantly, due to the lowered routing congestion, the EDP of the 3D FPGA is improved by 47%.
Keywords :
field programmable gate arrays; integrated circuit interconnections; integrated logic circuits; reconfigurable architectures; silicon-on-insulator; three-dimensional integrated circuits; 2D FPGA; 3D FPGA architecture; 3D interconnect capability; EDP; FDSOI technology; VPR5 toolflow; benchmark circuits; high-density interconnect monolithic integration; logic-on-memory approach; routing congestion; size 14 nm; Computer architecture; Field programmable gate arrays; Microprocessors; Monolithic integrated circuits; Routing; Three-dimensional displays; Through-silicon vias; 3D; FPGA; monolithic integration;
Conference_Titel :
Design, Automation and Test in Europe Conference and Exhibition (DATE), 2014
Conference_Location :
Dresden
DOI :
10.7873/DATE.2014.351
