• DocumentCode
    1295348
  • Title

    Evolution of Surface Morphology With Hydrogen Dilution During Silicon Epitaxy by Mesoplasma CVD

  • Author

    Diaz, Jose Mario A. ; Kambara, Makoto ; Yoshida, Toyonobu

  • Author_Institution
    Univ. of Tokyo, Tokyo, Japan
  • Volume
    37
  • Issue
    9
  • fYear
    2009
  • Firstpage
    1723
  • Lastpage
    1729
  • Abstract
    The influence of hydrogen in high-rate and low-temperature silicon epitaxy under mesoplasma conditions has been investigated from growth precursors and film structural evolution points of view. In situ small-angle X-ray scattering measurement has confirmed that silicon nanoclusters that are around 2 nm in size and having a loosely bound structure were formed as growth precursors, independent of the amount of hydrogen. Surface morphological analysis, on the other hand, has revealed that the deposition mechanism changes from surface diffusion to primarily step flow with hydrogen addition due potentially to the anisotropic etching of the silicon surface. Atomically smooth epitaxial films with Hall mobilities of up to 300 cm2/(V middots) were deposited accordingly at high partial pressures of hydrogen (> 220 mtorr), while polycrystalline films were produced at lower hydrogen amounts and still retaining relatively high electric properties.
  • Keywords
    Hall mobility; X-ray scattering; elemental semiconductors; etching; hydrogen; hydrogenation; nanostructured materials; plasma CVD; plasma CVD coatings; semiconductor epitaxial layers; semiconductor growth; silicon; surface diffusion; surface morphology; Hall mobility; Si:H; anisotropic etching; bound structure; film structural evolution; growth precursors; hydrogen dilution; mesoplasma CVD; polycrystalline films; silicon epitaxy; silicon nanoclusters; small-angle X-ray scattering; surface diffusion; surface morphology; Epitaxial growth; X-ray scattering; plasma CVD; silicon thin films;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2009.2024780
  • Filename
    5200396