Direct growth of copper nanowires on a substrate for boiling applications

A new technique utilising electrochemical deposition with the assistance of porous alumina membranes as the fabrication template is developed to directly grow metallic nanowires on different substrates. To emphasise the nanowire application in boiling enhancement, Cu nanowire (CuNW) has been successfully fabricated on Si, Au and Cu substrates with improved thermal properties and mechanical reliability. Several process parameters to control the CuNW growth have been discussed. The nanowire structures applied in pool boiling enhancement are further investigated and significant enhancements are observed with all the surfaces with nanowire structures.