• DocumentCode
    129564
  • Title

    CTGS material parameters obtained by versatile SAW measurements

  • Author

    Biryukov, Sergey V. ; Schmidt, Heidemarie ; Sotnikov, A. ; Weihnacht, M. ; Sakharov, S. ; Buzanov, O.

  • Author_Institution
    IFW Dresden, Dresden, Germany
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    882
  • Lastpage
    885
  • Abstract
    Recently big size high quality piezoelectric single crystals of Ca3TaGa3Si2O14 (CTGS) have been grown. This temperature durable crystal is very promising for future application in different devices based on surface acoustic waves (SAW) due to its high electromechanical coupling compared to quartz. In contrast to the popular langasite, CTGS is a more ordered compound and therefore stands for better characteristics at both, high temperatures and high frequencies. During the last decade several sets of material constants for CTGS were published extracted from bulk acoustic wave measurements on small samples, but these results are strongly different from each other. Moreover, all published constant sets lead to unacceptable numerical differences for calculated SAW velocities when compared to recent measurements of SAW velocities on large CTGS wafers. In this work we present a new set of room temperature CTGS material constants, extracted by combination of high-precision SAW phase velocity measurements with proprietary numerical procedures developed in-house.
  • Keywords
    calcium compounds; gallium compounds; piezoelectric materials; surface acoustic waves; tantalum compounds; ultrasonic materials testing; CTGS material parameters; CTGS wafers; Ca3TaGa3Si2O14; bulk acoustic wave measurements; electromechanical coupling; piezoelectric single crystals; surface acoustic waves; versatile SAW measurements; Acoustic measurements; Crystals; Surface acoustic waves; Temperature measurement; Velocity measurement; CTGS material parameters; SAW velocity measurements; surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0217
  • Filename
    6932021