Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits

Author

Dorkel, Jean-Marie ; Tounsi, Patrick ; Leturcq, Philippe

Author_Institution

Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France

Volume

19

Issue

4

fYear

1996

fDate

12/1/1996 12:00:00 AM

Firstpage

501

Lastpage

507

Abstract

This paper recalls how the two-port network theory can be extended to three-dimensional (3-D) conductive heat transfer in multilayered plane structures. Then it is shown how to build efficient computation tools by implementing this theory with help of fast Fourier transform (FFT) algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration is given concerning thermal analysis of an insulated gate bipolar power transistor (IGBT) power module and computed results are compared with experiment

Keywords

fast Fourier transforms; heat conduction; hybrid integrated circuits; insulated gate bipolar transistors; integrated circuit design; integrated circuit modelling; integrated circuit packaging; power integrated circuits; thermal analysis; two-port networks; IGBT power module; computation tools; conductive heat transfer; fast Fourier transform; hybrid integrated power circuits; integrated power circuits; multilayered plane structures; power components; rapid thermal analysis; three-dimensional thermal modeling; two-port network theory; Circuits; Electronic packaging thermal management; Fast Fourier transforms; Heat transfer; Insulated gate bipolar transistors; Insulation; Multichip modules; Power electronics; Power system modeling; Power transistors; Thermal conductivity; Transient analysis;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.554931

Filename

554931