Title :
Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits
Author :
Dorkel, Jean-Marie ; Tounsi, Patrick ; Leturcq, Philippe
Author_Institution :
Lab. d´´Anal. et d´´Archit. des Syst., CNRS, Toulouse, France
fDate :
12/1/1996 12:00:00 AM
Abstract :
This paper recalls how the two-port network theory can be extended to three-dimensional (3-D) conductive heat transfer in multilayered plane structures. Then it is shown how to build efficient computation tools by implementing this theory with help of fast Fourier transform (FFT) algorithms. These tools are particularly well-suited for the rapid thermal analysis of power components or hybrid and integrated power circuits. An illustration is given concerning thermal analysis of an insulated gate bipolar power transistor (IGBT) power module and computed results are compared with experiment
Keywords :
fast Fourier transforms; heat conduction; hybrid integrated circuits; insulated gate bipolar transistors; integrated circuit design; integrated circuit modelling; integrated circuit packaging; power integrated circuits; thermal analysis; two-port networks; IGBT power module; computation tools; conductive heat transfer; fast Fourier transform; hybrid integrated power circuits; integrated power circuits; multilayered plane structures; power components; rapid thermal analysis; three-dimensional thermal modeling; two-port network theory; Circuits; Electronic packaging thermal management; Fast Fourier transforms; Heat transfer; Insulated gate bipolar transistors; Insulation; Multichip modules; Power electronics; Power system modeling; Power transistors; Thermal conductivity; Transient analysis;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
