Title :
A closed form solution of junction to substrate thermal resistance in semiconductor chips
Author :
Masana, Francesc N.
Author_Institution :
Dept. of Electron. Eng., Univ. Politecnica de Catalunya, Barcelona, Spain
fDate :
12/1/1996 12:00:00 AM
Abstract :
The model presented in this work is based on an extension of the constant angle heat spreading, taking into account chip and substrate dimensions, and changing the spreading angle accordingly. This yields to closed form expressions accurate enough for most practical applications. Circular, square, and rectangular geometries have been analyzed and the results compared with Bessel and Fourier series-like solutions
Keywords :
Bessel functions; Fourier series; integrated circuit modelling; integrated circuit packaging; thermal resistance; Bessel series-like solutions; Fourier series-like solutions; circular geometries; closed form solution; constant angle heat spreading; junction to substrate thermal resistance; rectangular geometries; semiconductor chips; square geometries; substrate dimensions; Boundary conditions; Closed-form solution; Convergence of numerical methods; Electronic packaging thermal management; Geometry; Power system modeling; Resistance heating; Substrates; Thermal conductivity; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
