DocumentCode
1295869
Title
Mechanism of electrical conduction through anisotropically conductive adhesive films
Author
Mizuno, Masuo ; Saka, Masumi ; Abé, Hiroyuki
Author_Institution
Electron. Divice Mater. Res. Lab., Sumitomo Bakelite Co. Ltd., Utunomiya, Japan
Volume
19
Issue
4
fYear
1996
fDate
12/1/1996 12:00:00 AM
Firstpage
546
Lastpage
553
Abstract
Anisotropically conductive adhesive films (ACFs) which had different amount of electrically conductive particle contents and insulating particle contents were offered for measurement of electrical resistance between electrically conductive glass substrates and flexible printed circuits (FPCs) connected by using these ACFs. As a result, the electrical resistance for samples using ACFs containing electrically conductive particles was proved to he low, and also that for samples using ACFs containing insulating particles or no particles was proved to be considerably lower than we had expected. On the other hand, after high temperature and high humidity treatment or temperature cycle treatment, the electrical resistance for samples using ACFs containing electrically conductive particles did not change so much, but that for samples using ACFs containing insulating particles or no particles changed significantly, that is, it increased remarkably. From these facts, we presumed that there were two kinds of electric current passing through ACFs: one passing through electrically conductive particles and the other not passing through them; the current passing through electrically conductive particles did not change so much even after high temperature and high humidity treatment or temperature cycle treatment, but the current not passing through electrically conductive particles significantly reduced after the treatment mentioned above. On the basis of the above result, the role of conductive particles in ACFs was considered
Keywords
adhesion; composite materials; electric resistance; electrical conductivity; heat treatment; microassembling; packaging; printed circuit manufacture; surface mount technology; anisotropically conductive adhesive films; electric current; electrical conduction; electrical resistance; electrically conductive glass substrates; electrically conductive particle content; flexible printed circuits; high humidity treatment; high temperature treatment; insulating particle content; microbonding; temperature cycle treatment; Anisotropic conductive films; Anisotropic magnetoresistance; Conductive adhesives; Conductivity measurement; Dielectrics and electrical insulation; Electric resistance; Electrical resistance measurement; Flexible printed circuits; Humidity; Temperature;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.554936
Filename
554936
Link To Document