In-process board warpage measurement in a lab scale wave soldering oven

Author

Stiteler, Michael R. ; Ume, I. Charles ; Leutz, Brian

Author_Institution

Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

19

Issue

4

fYear

1996

fDate

12/1/1996 12:00:00 AM

Firstpage

562

Lastpage

569

Abstract

An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behavior of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process

Keywords

automatic test equipment; deformation; displacement measurement; light interferometry; moire fringes; printed circuit manufacture; printed circuit testing; production engineering computing; production testing; real-time systems; temperature distribution; wave soldering; PWB assemblies; automated online measurement system; board deformation; in-process board warpage measurement; lab scale wave soldering oven; printed wiring boards; real-time warpage measurements; shadow moire technique; soldering processes simulation; wave soldering process; Assembly systems; Electronics packaging; High speed integrated circuits; Integrated circuit packaging; Lead; Manufacturing; Ovens; Performance evaluation; Real time systems; Soldering; Surface-mount technology; System testing; Vehicles; Wiring;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.554938

Filename

554938