DocumentCode :
1296130
Title :
New Low-Leakage Power-Rail ESD Clamp Circuit in a 65-nm Low-Voltage CMOS Process
Author :
Ker, Ming-Dou ; Chiu, Po-Yen
Author_Institution :
Nanoelectron. & Gigascale Syst. Lab., Nat. Chiao Tung Univ., Hsinchu, Taiwan
Volume :
11
Issue :
3
fYear :
2011
Firstpage :
474
Lastpage :
483
Abstract :
A new low-leakage power-rail electrostatic discharge (ESD) clamp circuit designed with consideration of the gate leakage issue has been proposed and verified in a 65-nm low-voltage CMOS process. Consisting of the new low-leakage ESD-detection circuit and the ESD clamp device of a substrate-triggered silicon-controlled rectifier, the new proposed power-rail ESD clamp circuit realized with only thin-oxide (1-V) devices has a very low leakage current of only 116 nA at room temperature (25°C ) under the power-supply voltage of 1 V. Moreover, the new proposed power-rail ESD clamp circuit can achieve ESD robustness of over 8 kV, 800 V, and over 2 kV in human-body-model, machine-model, and charged-device-model ESD tests, respectively.
Keywords :
CMOS integrated circuits; electrostatic discharge; charged-device-model ESD tests; current 116 nA; electrostatic discharge clamp circuit; gate leakage issue; human-body-model; low-leakage power-rail ESD clamp circuit; low-voltage CMOS process; machine-model; size 65 nm; substrate-triggered silicon-controlled rectifier; temperature 25 degC; temperature 293 K to 298 K; thin-oxide devices; voltage 1 V; CMOS process; Circuit testing; Clamps; Electrostatic discharge; Gate leakage; Leakage current; Rectifiers; Robustness; Temperature; Voltage; Electrostatic discharge (ESD); gate leakage; power-rail ESD clamp circuit; substrate-triggered silicon-controlled rectifier (STSCR);
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2010.2066976
Filename :
5549874
Link To Document :
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