• DocumentCode
    129629
  • Title

    Simulation model for CMUT with rapid structure fluid interaction in time domain

  • Author

    Klemm, Michael ; Unamuno, Anartz

  • Author_Institution
    Fraunhofer IPMS, Dresden, Germany
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    293
  • Lastpage
    296
  • Abstract
    The dynamic deflection and acoustic radiation of thin plates or membranes greatly depends on the acoustic load on top of the vibrating structure. An electro-acousto-mechanical model has been built describing the solid-fluid interaction in time domain. The model is optimized for thin plates and membranes, and can be used for simulating CMUTs (Capacitive Micromachined Ultrasonic Transducers) in different fluids, but is also valid for any vibrating structure. The model provides accurate information about the sound pressure on the surface of the transducer, taking into account the dynamical force indicated to the vibrating structure by the fluid. All calculations are done in time domain keeping the nonlinear behavior of the transducer. Simulations results for CMUT designs with resonant frequencies between 5 an 40 MHz have been compared to measurements results on devices fabricated at Fraunhofer IPMS showing good agreement.
  • Keywords
    acoustic wave effects; membranes; plates (structures); structural acoustics; ultrasonic transducers; vibrations; CMUT design; CMUT simulation; Fraunhofer IPMS; acoustic load; acoustic radiation; capacitive micromachined ultrasonic transducers; dynamic deflection; dynamical force; electro-acousto-mechanical model; frequency 5 MHz to 40 MHz; nonlinear behavior; rapid structure fluid interaction; solid-fluid interaction; sound pressure; thin membranes; thin plates; time domain; transducer surface; vibrating structure; Acoustics; Atmospheric modeling; Frequency measurement; Integrated circuit modeling; Load modeling; Resonant frequency; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0072
  • Filename
    6932086