• DocumentCode
    1296310
  • Title

    Dynamic Modeling and Transient Performance Analysis of a LHP-MEMS Thermal Management System for Spacecraft Electronics

  • Author

    Li, Yun-Ze ; Wang, Yu-Ying ; Lee, Kok-Meng

  • Author_Institution
    Sch. of Aeronaut. Sci. & Eng., Beihang Univ., Beijing, China
  • Volume
    33
  • Issue
    3
  • fYear
    2010
  • Firstpage
    597
  • Lastpage
    606
  • Abstract
    Transient performance analysis is essential for the successful design of a spacecraft thermal management system. This paper presents three dynamic models for analyzing system-level transient responses of a loop heat pipe (LHP)-micro-electromechanical-system (MEMS) thermal management system consisting of a LHP and a variable emittance radiator employing MEMS technologies. The recommended hybrid mathematical model, which is deduced from the fundamental 3-node and 4-node thermal networks, provides an efficient closed-form equation enabling direct calculation of the fluid mass flowrate in the LHP from the nodal temperatures of the thermal management system, and a set of state equations that independently compute the temperature responses of the cooled object, LHP evaporator, LHP condenser, and MEMS radiator. The temperature transients of a 50 W LHP-MEMS thermal management system, as well as the hydraulic responses inside the employed LHP, were numerically investigated and discussed in detail.
  • Keywords
    micromechanical devices; space vehicle electronics; thermal management (packaging); transient analysis; LHP-MEMS; dynamic modeling; spacecraft electronics; thermal management system; transient performance analysis; Aerospace electronics; Equations; Mathematical model; Micromechanical devices; Numerical models; Performance analysis; Space vehicles; Technology management; Temperature; Thermal management; Thermal management of electronics; Thermal resistance; Transient analysis; Dynamic modeling; loop heat pipe; micro-electromechanical-system (MEMS) radiator; spacecraft electronics; thermal management; transient performance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2010.2049358
  • Filename
    5549900