Title :
Dynamic Modeling and Transient Performance Analysis of a LHP-MEMS Thermal Management System for Spacecraft Electronics
Author :
Li, Yun-Ze ; Wang, Yu-Ying ; Lee, Kok-Meng
Author_Institution :
Sch. of Aeronaut. Sci. & Eng., Beihang Univ., Beijing, China
Abstract :
Transient performance analysis is essential for the successful design of a spacecraft thermal management system. This paper presents three dynamic models for analyzing system-level transient responses of a loop heat pipe (LHP)-micro-electromechanical-system (MEMS) thermal management system consisting of a LHP and a variable emittance radiator employing MEMS technologies. The recommended hybrid mathematical model, which is deduced from the fundamental 3-node and 4-node thermal networks, provides an efficient closed-form equation enabling direct calculation of the fluid mass flowrate in the LHP from the nodal temperatures of the thermal management system, and a set of state equations that independently compute the temperature responses of the cooled object, LHP evaporator, LHP condenser, and MEMS radiator. The temperature transients of a 50 W LHP-MEMS thermal management system, as well as the hydraulic responses inside the employed LHP, were numerically investigated and discussed in detail.
Keywords :
micromechanical devices; space vehicle electronics; thermal management (packaging); transient analysis; LHP-MEMS; dynamic modeling; spacecraft electronics; thermal management system; transient performance analysis; Aerospace electronics; Equations; Mathematical model; Micromechanical devices; Numerical models; Performance analysis; Space vehicles; Technology management; Temperature; Thermal management; Thermal management of electronics; Thermal resistance; Transient analysis; Dynamic modeling; loop heat pipe; micro-electromechanical-system (MEMS) radiator; spacecraft electronics; thermal management; transient performance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2010.2049358