• DocumentCode
    1296591
  • Title

    Laser ablation and micromachining with ultrashort laser pulses

  • Author

    Liu, X. ; Du, D. ; Mourou, G.

  • Author_Institution
    Center for Ultrafast Optical Sci., Michigan Univ., Ann Arbor, MI, USA
  • Volume
    33
  • Issue
    10
  • fYear
    1997
  • fDate
    10/1/1997 12:00:00 AM
  • Firstpage
    1706
  • Lastpage
    1716
  • Abstract
    The mechanisms of ultrashort-pulse laser ablation of materials are discussed, and the differences to that of long laser pulses are emphasized. Ultrashort laser pulses offer both high laser intensity and precise laser-induced breakdown threshold with reduced laser fluence. The ablation of materials with ultrashort pulses has a very limited heat-affected volume. The advantages of ultrashort laser pulses are applied in precision micromachining of various materials. Some femtosecond laser pulse micromachining results, including comparison with long pulses, are presented. Ultrashort-pulse laser micromachining may have a wide range of applications where micrometer and submicrometer feature sizes are required
  • Keywords
    avalanche breakdown; electric breakdown; high-speed optical techniques; impact ionisation; laser ablation; laser beam machining; micromachining; femtosecond laser pulse; heat-affected volume; high laser intensity; micromachining; micrometer feature sizes; precise laser-induced breakdown threshold; reduced laser fluence; submicrometer feature sizes; ultrashort laser pulses; ultrashort-pulse laser ablation; Gas lasers; Laser ablation; Laser applications; Laser beam cutting; Machining; Micromachining; Optical materials; Optical pulses; Pulse amplifiers; Ultrafast optics;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/3.631270
  • Filename
    631270