DocumentCode
1296655
Title
Issues in the Use of Thermal Transients to Achieve Accurate Time-Constant Spectrums and Differential Structure Functions
Author
Salleras, Marc ; Carmona, Manuel ; Marco, Santiago
Author_Institution
Mech. & Aerosp. Eng. Dept., Univ. of California Irvine, Irvine, CA, USA
Volume
33
Issue
4
fYear
2010
Firstpage
918
Lastpage
923
Abstract
An analysis of accuracy of time-constant spectrum extraction from thermal transients has been performed. Numerical calculations based on analytical models and finite element method simulations have been used in order to obtain the thermal transients. Simple geometries have been used such that analytical expressions for their time-constant spectrums are known. Results show that a large error in the time-constant spectrum is obtained for very small rms error (<;1 mK) in the thermal transient. The estimation problem is ill-conditioned. Moreover, the differential structure function shows a low accuracy identifying stacked structures. The initial part of the differential structure function shows numerical oscillations and the final part has an asymptotic behavior to infinity that has been identified as an artifact related to errors in the time-constant spectrum estimation. Peak identification from the differential structure function heavily depends on an accurate determination of the time-constant spectrum. The limited spectral resolution and dynamic range of the differential structure function are a direct consequence of the time-constant spectrum imprecision.
Keywords
finite element analysis; spectral analysis; accurate time-constant spectrums; asymptotic behavior; differential structure functions; estimation problem; finite element method; peak identification; spectral resolution; thermal transients; time-constant spectrum estimation; time-constant spectrum extraction; time-constant spectrum imprecision; Analytical models; Electronic packaging thermal management; Finite element methods; Impedance; Integrated circuit modeling; Integrated circuit packaging; Material properties; Noise level; Silicon; Slabs; Thermal analysis; Transient analysis; Differential structure function; packaging; thermal transient; time-constant spectrum;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2010.2049572
Filename
5549952
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