Title :
Packaging Considerations for a Surface Acoustic Wave Strain Sensor
Author :
Donohoe, Brian ; Geraghty, Dermot ; O´Donnell, Garret E. ; Stoney, Rory
Author_Institution :
Dept. of Mech. & Manuf. Eng., Trinity Coll., Dublin, Ireland
fDate :
5/1/2012 12:00:00 AM
Abstract :
In this paper, packaging effects for a one port surface acoustic wave resonator (SAWR) strain sensor are considered. A one port non apodized SAWR fabricated on AT-X quartz is hermetically packaged using commercial off the shelf packages and standard strain gauge adhesives. The package geometry is such to allow the final device to act as a modular general purpose SAWR strain sensor. Calibration of the packaged sensor was performed for a range of temperatures and loading conditions and the results are presented within this paper.
Keywords :
adhesives; calibration; strain sensors; surface acoustic wave sensors; AT-X quartz; SAWR strain sensor; packaged sensor calibration; packaging considerations; strain gauge adhesives; surface acoustic wave strain sensor; Calibration; Packaging; Strain; Surface acoustic waves; Temperature sensors; Packaging; SAWR; sensor; strain;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2011.2164790