• DocumentCode
    129706
  • Title

    Simulation for viscoelastic effects of SH-SAW biosensor

  • Author

    Goto, Misako ; Yatsuda, Hiromi ; Kondoh, Jun

  • Author_Institution
    Biosensor Project, Japan Radio Co., Ltd., Fujimino, Japan
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    2051
  • Lastpage
    2054
  • Abstract
    This paper describes a simulation for the shear horizontal surface acoustic wave (SH-SAW) immunoassay biosensor on quartz. A simulation method which was proposed by Campbell and Jones has been generally used to calculate SH-SAW propagation characteristics. In the analysis of the bioreactions with mass loading, the sensitivities of SH-SAW biosensors are too small to confirm the experimental results. In the analysis of the bio-reactions with viscosity sensitivity, the absolute values of velocity and attenuation changes of SH-SAWs agreed with the experiments. In this paper, we analyze the bio-reactions as viscoelastic sensitivity of SH-SAW biosensors using a numerical calculation method. In order to confirm the proposed numerical analysis, 250MHz SH-SAW biosensors on quartz substrates were tested using different thickness of bovine serum albumin (BSA) layers. A simple viscoelastic model is applied to explain the experimental results.
  • Keywords
    biochemistry; biomechanics; biosensors; molecular biophysics; numerical analysis; proteins; surface acoustic wave sensors; viscoelasticity; viscosity; BSA layers; SH-SAW immunoassay biosensors; SH-SAW propagation characteristics; SiO2; bioreactions; bovine serum albumin layers; mass loading; numerical calculation; quartz substrates; shear horizontal surface acoustic wave immunoassay biosensor; viscoelastic effects; viscoelastic sensitivity; viscosity sensitivity; Biological system modeling; Biosensors; Films; Gold; Liquids; Loading; Surface acoustic waves; SH-SAW; biosenosr; numerical analysis; viscoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0511
  • Filename
    6932164