DocumentCode :
1297577
Title :
Single Event Upset and Multiple Cell Upset Modeling in Commercial Bulk 65-nm CMOS SRAMs and Flip-Flops
Author :
Uznanski, Slawosz ; Gasiot, Gilles ; Roche, Philippe ; Tavernier, Clement ; Autran, Jean-Luc
Author_Institution :
Central CAD & Design Solutions, STMicroelectronics, Crolles, France
Volume :
57
Issue :
4
fYear :
2010
Firstpage :
1876
Lastpage :
1883
Abstract :
A proprietary Monte-Carlo simulation code dedicated to heavy ion cross-section prediction has been developed. The code is based on diffusion-collection equations, takes into account recombination processes, uses an improved drain strike model, and includes new upset analysis algorithms for different circuit architectures. Simulated cross-sections are compared to heavy ion experimental characterizations for commercial bulk 65-nm single- and dual-port SRAMs. Simulation capabilities of much more complex circuits are demonstrated considering a 65-nm radiation-hardened-by-design (RHBD) Flip-Flop (FF).
Keywords :
CMOS integrated circuits; Monte Carlo methods; flip-flops; ion beam effects; radiation hardening (electronics); CMOS SRAM; Monte-Carlo simulation code; account recombination processes; circuit architectures; diffusion-collection equations; heavy ion cross-section; heavy ion radiation; multiple cell upset modeling; radiation-hardened-by-design Flip-Flop; single event upset modeling; Algorithm design and analysis; Analytical models; Circuit simulation; Computational modeling; Computer architecture; Equations; Error correction codes; Flip-flops; Integrated circuit modeling; Junctions; Mathematical model; Microprocessors; Random access memory; SPICE; Semiconductor device modeling; Single event upset; DICE; MCU; Monte-Carlo simulation; Radiation-Hardened-By-Design; SEU; SEU cross-section; SPICE;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2010.2051039
Filename :
5550413
Link To Document :
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