DocumentCode
129763
Title
Correlation between structural properties of AlN/Sapphire and performances of SAW devices in wide temperature range
Author
Aissa, K. Ait ; Elmazria, O. ; Boulet, P. ; Aubert, T.
Author_Institution
Inst. Jean Lamour, Univ. de Lorraine, Nancy, France
fYear
2014
fDate
3-6 Sept. 2014
Firstpage
385
Lastpage
387
Abstract
Aluminum nitride (AlN) on sapphire is a promising substrate for surface acoustic wave (SAW) sensors operating at high temperatures and high frequencies. To get an experimental measure of the suitability and temperature stability of such devices an experimental relationship between surface acoustic wave (SAW) performances of AlN thin films and their structural properties was investigated in the same range of temperature between 50°C and 1000°C. The crystalline structure of AlN films was examined in-situ versus temperature (50-1000°C) by X-ray diffraction. The results reveal that the AlN film remains well oriented (002) even at the high temperature. A significant change in the values of the c-lattice parameter has been observed due to the thermal expansion mismatch and strain relaxation between the AlN crystal and substrate. The correlation between the crystalline quality and the SAW performances of AlN/Sapphire reveal that the evolution of the crystalline quality of the AlN film with temperature (in a range of 600-850 °C) follows similar trends as the evolution of relative insertion loss. The surface oxidation of the film has been observed at high annealing temperature (>850°C) which reduce the crystalline quality and piezoelectric response of the AlN film.
Keywords
X-ray diffraction; aluminium compounds; annealing; lattice constants; oxidation; silicon compounds; surface acoustic wave sensors; thermal expansion; AlN-SiO2; SAW devices; X-ray diffraction; aluminum nitride; annealing temperature; c-lattice parameter; crystalline structure; insertion loss; sapphire; strain relaxation; suitability; surface acoustic wave sensors; surface oxidation; temperature 50 degC to 1000 degC; thermal expansion mismatch; Annealing; Films; III-V semiconductor materials; Substrates; Temperature distribution; Temperature measurement; Temperature sensors; Aluminum nitride; in-situ annealing temperature; surface acoustic wave;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.2014.0095
Filename
6932221
Link To Document