DocumentCode
129792
Title
Design of a driver IC for an ultrasound catheter ablation system
Author
Bozkurt, Alican ; Farhanieh, Omid ; Roy, Rajib Baran ; Ergun, Arif Sanli
Author_Institution
Sabanci Univ., Istanbul, Turkey
fYear
2014
fDate
3-6 Sept. 2014
Firstpage
1536
Lastpage
1539
Abstract
High Intensity Focused Ultrasound (HIFU) is generally administered externally, or through body orifices such as the esophagus, the urethra, the uterus, or the rectum. The devices used in conventional treatment are not suitable to be used in endoscopic interventions or in intravascular catheterization due to their dimensions. This paper presents the design of a drive integrated circuit for driving a CMUT therapy array of 2 mm diameter such that whole device fit through key holes in endoscopic treatment or through vessels. The proposed ASIC is composed of (1) an 8 channel drive signal generator, (2) 8 high voltage drivers, and (3) a PLL for the local generation of a high frequency tunable master clock signal based on a low frequency reference. All designs are in austriamicrosystems h35 High-Voltage CMOS technology with 1.3×3 mm2 die area including ESD protection pads.
Keywords
CMOS integrated circuits; application specific integrated circuits; biomedical electronics; biomedical transducers; biomedical ultrasonics; catheters; driver circuits; integrated circuit design; signal generators; ultrasonic therapy; ultrasonic transducer arrays; ASIC; CMUT therapy array; ESD protection pads; HIFU; High Voltage CMOS technology; drive integrated circuit; drive signal generator; driver IC design; endoscopic interventions; high frequency tunable master clock signal; high intensity focused ultrasound; intravascular catheterization; low frequency reference; size 1.3 mm; size 2 mm; size 3 mm; ultrasound catheter ablation system; voltage drivers; Charge pumps; Clocks; Frequency control; Frequency conversion; Phase frequency detector; Phase locked loops; Voltage-controlled oscillators; ASIC; CMUT; Drive signal generator; HIFU; High voltage driver; PLL;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.2014.0380
Filename
6932250
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