DocumentCode :
1298069
Title :
Dynamic Finite Element Analysis of Failure in Alternating Phase-Shift Masks Caused by Megasonic Cleaning
Author :
Yin, X. ; Komvopoulos, K.
Author_Institution :
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
Volume :
33
Issue :
1
fYear :
2010
fDate :
3/1/2010 12:00:00 AM
Firstpage :
46
Lastpage :
55
Abstract :
The mechanical response of alternating phase-shift mask (APSM) microstructures subjected to dynamic pressure loadings relevant to those encountered in megasonic cleaning was analyzed with the finite element method (FEM). A parametric study of the effects of microstructure dimensions, pressure amplitude, and loading frequency on the mask structural integrity was performed for two typical chromium/quartz APSM patterns. Failure due to microfracture and plastic deformation processes which may occur during megasonic cleaning was examined for loading frequencies of 1, 5, and 10 MHz. The FEM results provide insight into possible failure modes and critical microstructure dimensions for instantaneous microstructure damage. Different failure scenarios revealed by the FEM results are in qualitative agreement with experimental observations. The results of this study have direct implications to the design of extreme ultraviolet lithography masks and the optimization of the megasonic cleaning process.
Keywords :
failure analysis; finite element analysis; fracture; microcracks; phase shifting masks; plastic deformation; ultrasonic cleaning; ultraviolet lithography; APSM; FEM; alternating phase-shift masks; dynamic finite element analysis; dynamic pressure loadings; extreme ultraviolet lithography masks; failure; frequency 1 MHz; frequency 10 MHz; frequency 5 MHz; mask structural integrity; megasonic cleaning; microfracture; microstructure damage; microstructure dimensions; plastic deformation; pressure amplitude; Alternating phase-shift mask (APSM); failure modes; finite element method (FEM); megasonic cleaning; microcracking; plastic deformation;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2009.2021393
Filename :
5204107
Link To Document :
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