DocumentCode
1298157
Title
Solving EMI-Related Problems for Reliable High-Power Converters Design With Precomputed Electromagnetic Models
Author
Blanchette, Handy Fortin ; Al-Haddad, Kamal
Author_Institution
Dept. of Genie Electr., Ecole de Technol. Super. (ETS), Montreal, QC, Canada
Volume
25
Issue
1
fYear
2010
Firstpage
219
Lastpage
227
Abstract
Interactions between low-power control circuits such as DSP or field-programmable gate array (FPGA), and high-power switching components that generate high ??i/??t greatly decrease the reliability of power converters. Moreover, they increase substantially the product´s time to market when introducing a new design. The analysis of these couplings is traditionally done by using the finite elements method, which requires high technical expertise for complex 3-D circuit geometries. To overcome this requirement, the authors propose an approach based on the use of a precomputed electromagnetic model (PEM) library, which includes several metallic conducting structures present in modern power converters. Transistor cases, as well as printed circuit board (PCB) copper traces, are included in this library. By using these library models, high-coupling areas with higher flux density can be quickly identified in the converter 3-D layout. This helps to develop a remedial strategy for avoiding higher flux density areas. The proposed approach is used to analyze the electromagnetic behavior of a bidirectional matrix converter cell. Experimental results are also presented to further demonstrate the viability of the new proposed approach.
Keywords
circuit reliability; circuit theory; electromagnetic interference; finite element analysis; matrix convertors; printed circuits; DSP; EMI-related problems; FPGA; and high-power switching components; bidirectional matrix converter cell; complex 3D circuit geometries; field-programmable gate array; finite elements method; high flux density; high-power converters design; low-power control circuits; metallic conducting structures; power converter reliability; precomputed electromagnetic models; printed circuit board; transistor; Electromagnetic coupling; electromagnetic interference (EMI); matrix converter; printed circuit layout; reliability;
fLanguage
English
Journal_Title
Power Electronics, IEEE Transactions on
Publisher
ieee
ISSN
0885-8993
Type
jour
DOI
10.1109/TPEL.2009.2027708
Filename
5204125
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