DocumentCode
129824
Title
Estimation of consolidation profiles for archaeological ceramics using ultrasonic signature
Author
Salazar, Addisson ; Safont, Gonzalo ; Rodriguez, Alex ; Vergara, Luis
Author_Institution
Inst. of Telecommun. & Multimedia Applic., Univ. Politec. de Valencia, València, Spain
fYear
2014
fDate
3-6 Sept. 2014
Firstpage
365
Lastpage
368
Abstract
This paper presents a method for estimation of consolidation profiles for archaeological ceramics that uses an ultrasonic signature. The consolidation process consists in injecting a material in the ceramic to preserve it from damage. The signature consists of a set of features extracted from an ultrasonic signal that is recorded in through-transmission mode. The method is experimentally validated by means of an extensive number of simulations by varying the following parameters: (i) consolidation products: acryl resin, ethyl silicate, and ethyl metacrylato; (ii) percentage of material consolidation; (iii) consolidation method: impregnation and immersion; and (iv) concentration of consolidation product: low and high. Besides, several classifications of real ceramics shards were performed, demonstrating that the method is able to distinguish among different material consolidation conditions and consolidation methods and can be used as the basis for an automatic system for archaeological ceramics restoration.
Keywords
archaeology; ceramics; feature extraction; ultrasonic materials testing; acryl resin; archaeological ceramics restoration; ceramics shards; consolidation method; consolidation products; consolidation profile estimation; ethyl metacrylato; ethyl silicate; feature extraction; immersion; impregnation; material consolidation; through-transmission mode; ultrasonic signal; ultrasonic signature; Acoustics; Attenuation; Ceramics; Feature extraction; Resins; Ultrasonic imaging; archaeological ceramic; classification; material consolidation; non-destructive testing; ultrasonic signature; ultrasound;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/ULTSYM.2014.0090
Filename
6932282
Link To Document