• DocumentCode
    1298247
  • Title

    Poly-Si thin-film transistors on steel substrates

  • Author

    Howell, R.S. ; Stewart, M. ; Kamik, S.V. ; Saha, S.K. ; Hatalis, M.K.

  • Author_Institution
    Display Res. Lab., Lehigh Univ., Bethlehem, PA, USA
  • Volume
    21
  • Issue
    2
  • fYear
    2000
  • Firstpage
    70
  • Lastpage
    72
  • Abstract
    We report the successful fabrication of poly-Si thin-film transistors (TFTs) on stainless steel substrates. The TFTs were fabricated on a 500 μm thick polished stainless steel substrate using furnace crystallized amorphous Si deposited by PECVD. These devices typically have threshold voltages of 8.6 V, linear effective mobilities of 6.2 cm2/V/spl middot/s and subthreshold slopes of 0.93 decade/V. This work demonstrates the feasibility of poly-Si TFTs on stainless steel substrates and identifies some critical issues involved in poly Si processing on stainless steel. This will enable the fabrication of arrays with integrated drivers on a cheap, flexible and durable substrate for various displays and other large area array microelectronic applications.
  • Keywords
    carrier mobility; elemental semiconductors; plasma CVD; semiconductor growth; silicon; thin film transistors; 500 micron; 8.6 V; FeCrC; PECVD; Si-FeCrC; furnace crystallized material; integrated drivers; large area array microelectronic applications; linear effective mobilities; polysilicon thin-film transistors; stainless steel substrates; subthreshold slopes; threshold voltages; Amorphous materials; Crystallization; Displays; Fabrication; Furnaces; Microelectronics; Steel; Substrates; Thin film transistors; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.821670
  • Filename
    821670