• DocumentCode
    129871
  • Title

    Rotational capacitive micromachined ultrasonic transducers

  • Author

    Donghwan Kim ; Kuntzman, Michael L. ; Hall, Neal A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2014
  • fDate
    3-6 Sept. 2014
  • Firstpage
    170
  • Lastpage
    173
  • Abstract
    A rotational capacitive micromachined ultrasonic transducer (RCMUT) for airborne ultrasound applications is presented. The device is comprised of two conventional parallel-plate CMUTs mechanically coupled via a pivoting-beam structure. The cavity beneath each CMUT piston is vacuum-sealed to reduce thermal-mechanical noise and unwanted air-film dynamics. The pivoting structure is designed to provide high bending stiffness and low rotational stiffness. The beam therefore serves to reduce common-mode deflection of the structure under large omnipresent atmospheric pressure that statically loads the structure upon vacuum sealing, while enabling the structure to maintain sensitivity to small differential pressure between diaphragms. The coupling structure therefore permits larger, more compliant vacuum-sealed diaphragms to exist than would otherwise be possible without the coupling structure. Theoretically, this enables a design path towards highly-compliant, vacuum-sealed sensors to address relatively-low frequency airborne ultrasound applications. The paper summarizes the fabrication of prototypes and their dynamic characterization using electrostatic drive signals and laser Doppler vibrometry.
  • Keywords
    diaphragms; micromachining; thermal noise; ultrasonic transducers; air film dynamics; airborne ultrasound applications; common mode deflection; diaphragm; laser Doppler vibrometry; parallel plate CMUT; pivoting beam structure; rotational capacitive micromachined ultrasonic transducers; sensitivity; thermal mechanical noise; Acoustics; Fabrication; Frequency measurement; Laser beams; Pistons; Resonant frequency; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2014 IEEE International
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2014.0043
  • Filename
    6932330