DocumentCode :
129871
Title :
Rotational capacitive micromachined ultrasonic transducers
Author :
Donghwan Kim ; Kuntzman, Michael L. ; Hall, Neal A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
170
Lastpage :
173
Abstract :
A rotational capacitive micromachined ultrasonic transducer (RCMUT) for airborne ultrasound applications is presented. The device is comprised of two conventional parallel-plate CMUTs mechanically coupled via a pivoting-beam structure. The cavity beneath each CMUT piston is vacuum-sealed to reduce thermal-mechanical noise and unwanted air-film dynamics. The pivoting structure is designed to provide high bending stiffness and low rotational stiffness. The beam therefore serves to reduce common-mode deflection of the structure under large omnipresent atmospheric pressure that statically loads the structure upon vacuum sealing, while enabling the structure to maintain sensitivity to small differential pressure between diaphragms. The coupling structure therefore permits larger, more compliant vacuum-sealed diaphragms to exist than would otherwise be possible without the coupling structure. Theoretically, this enables a design path towards highly-compliant, vacuum-sealed sensors to address relatively-low frequency airborne ultrasound applications. The paper summarizes the fabrication of prototypes and their dynamic characterization using electrostatic drive signals and laser Doppler vibrometry.
Keywords :
diaphragms; micromachining; thermal noise; ultrasonic transducers; air film dynamics; airborne ultrasound applications; common mode deflection; diaphragm; laser Doppler vibrometry; parallel plate CMUT; pivoting beam structure; rotational capacitive micromachined ultrasonic transducers; sensitivity; thermal mechanical noise; Acoustics; Fabrication; Frequency measurement; Laser beams; Pistons; Resonant frequency; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0043
Filename :
6932330
Link To Document :
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