DocumentCode :
129903
Title :
Bandwidth and sensitivity optimization in CMUTs for airborne applications
Author :
Apte, Nikhil ; Kwan Kyu Park ; Nikoozadeh, Amin ; Khuri-Yakub, Butrus T.
Author_Institution :
E.L. Ginzton Lab., Stanford Univ., Stanford, CA, USA
fYear :
2014
fDate :
3-6 Sept. 2014
Firstpage :
166
Lastpage :
169
Abstract :
We previously proposed venting the cavities of CMUTs for using them in environments with extreme pressure variation. Such CMUTs have zero differential pressure across the plate at any ambient pressure, thus ensuring a stable operating point and preventing mechanical failure. The air in the cavity between the moving CMUT plate and the substrate forms a squeeze film which gives some stiffening and damping effect to the CMUT. The additional damping from the squeeze film helps to enhance the CMUT´s bandwidth significantly. By properly selecting the size, number, and location of the venting holes, the squeeze film effect can be controlled and the sensitivity and bandwidth of the CMUT can be optimized. We developed a finite element model for simulating such CMUTs with vented cavities. Using this model, we designed a variety of CMUTs with varying sensitivity and bandwidth. These CMUTs were fabricated and characterized. The measurements closely match our finite element model results.
Keywords :
capacitive sensors; damping; finite element analysis; micromachining; optimisation; ultrasonic transducers; vents (mechanical components); CMUT; airborne applications; bandwidth optimization; capacitive micromachined ultrasound transducers; damping effect; extreme pressure variation; finite element model; sensitivity optimization; squeeze film; stable operating point; stiffening effect; vented cavities; venting hole location; venting hole number; venting hole size; zero differential pressure; Bandwidth; Cavity resonators; Damping; Films; Frequency measurement; Mathematical model; Vents; squeeze film damping; varying pressure; vented CMUT;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/ULTSYM.2014.0042
Filename :
6932362
Link To Document :
بازگشت