Title :
Enhancement of direct brain infusion with focused ultrasound and microbubbles
Author :
Shutao Wang ; Tao Sun ; Acosta, Camilo ; Karakatsani, Maria Eleni ; Olumolade, Oluyemi ; Samiotaki, Gesthimani ; Konofagou, Elisa
Author_Institution :
Dept. of Biomed. Eng., Columbia Univ., New York, NY, USA
Abstract :
Direct infusion to the brain is a frequently used technique in pre-clinical neuroscience research as well as several clinical applications. The relatively high intracranial pressure is one of the limiting factors that hinder efficient diffusion from the cannula tip. In this study, we utilized focused ultrasound (FUS) and microbubbles to condition the brain prior to performing the direct infusion. The acoustic parameters used for sonications were: 0.45 MPa peak rarefactional pressure, 6.7 ms pulse length, 5 Hz pulse repetition frequency, and a duration of 60 s. A 9.4 T magnetic resonance imaging (MRI) system was used to monitor the diffusion of an albumin-tagged MR contrast agent up to two hours. In addition, the diffusion of a commonly used gene therapy vector - adeno-associated virus (AAV) was evaluated via fluorescence imaging. Our results revealed that Pre-treatment with FUS and microbubbles significantly enhanced the total volume (P<;0.001) and volume increase (P<;0.05) of MR contrast agent in vivo.
Keywords :
biomedical ultrasonics; brain; drug delivery systems; FUS; MRI system; acoustic parameters; adeno-associated virus; albumin tagged MR contrast agent; cannula tip; clinical applications; direct brain infusion enhancement; fluorescence imaging; focused ultrasound; frequency 5 Hz; gene therapy vector; intracranial pressure; magnetic flux density 9.4 T; magnetic resonance imaging system; microbubbles; peak rarefactional pressure; preclinical neuroscience research; pressure 0.45 MPa; pulse length; time 6.7 ms; time 60 s; Acoustics; Compounds; Fluorescence; Magnetic resonance imaging; Mice; Transducers; Ultrasonic imaging; AAV; brain; direct infusion; focused ultrasound;
Conference_Titel :
Ultrasonics Symposium (IUS), 2014 IEEE International
Conference_Location :
Chicago, IL
DOI :
10.1109/ULTSYM.2014.0540