DocumentCode
1299371
Title
Wafer scale integration
Author
Butcher, J.B. ; Johnstone, K.K.
Author_Institution
Middlesex Polytech., London, UK
Volume
135
Issue
6
fYear
1988
fDate
11/1/1988 12:00:00 AM
Firstpage
281
Lastpage
288
Abstract
The history of integrated circuit development has been one of continually decreasing feature size, accompanied by a much more gradual increase in chip dimensions. There are obvious limits to both of these trends. In the case of chip size, clearly, the limit is the whole wafer, offering a circuit area on a 15 cm wafer that is roughly 175 times larger than current VLSI chips. Such a step function in chip size offers a massive increase in potential functional complexity, but also implies a radical rethink of philosophy in design, fabrication, test and packaging. This article discusses the problems associated with the development of WSI technology and reviews some of the strategies that have been adopted in the pursuit of WSI sub-systems.
Keywords
VLSI; VLSI; design; fabrication; functional complexity; packaging; test; wafer scale integration;
fLanguage
English
Journal_Title
Computers and Digital Techniques, IEE Proceedings E
Publisher
iet
ISSN
0143-7062
Type
jour
Filename
6542
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