• DocumentCode
    1299371
  • Title

    Wafer scale integration

  • Author

    Butcher, J.B. ; Johnstone, K.K.

  • Author_Institution
    Middlesex Polytech., London, UK
  • Volume
    135
  • Issue
    6
  • fYear
    1988
  • fDate
    11/1/1988 12:00:00 AM
  • Firstpage
    281
  • Lastpage
    288
  • Abstract
    The history of integrated circuit development has been one of continually decreasing feature size, accompanied by a much more gradual increase in chip dimensions. There are obvious limits to both of these trends. In the case of chip size, clearly, the limit is the whole wafer, offering a circuit area on a 15 cm wafer that is roughly 175 times larger than current VLSI chips. Such a step function in chip size offers a massive increase in potential functional complexity, but also implies a radical rethink of philosophy in design, fabrication, test and packaging. This article discusses the problems associated with the development of WSI technology and reviews some of the strategies that have been adopted in the pursuit of WSI sub-systems.
  • Keywords
    VLSI; VLSI; design; fabrication; functional complexity; packaging; test; wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Computers and Digital Techniques, IEE Proceedings E
  • Publisher
    iet
  • ISSN
    0143-7062
  • Type

    jour

  • Filename
    6542