DocumentCode :
1299471
Title :
Silica-Encapsulated Nanoparticle Films as Surface Modifications for MEMS
Author :
Hurst, Kendall M. ; Ansari, Nayeem ; Roberts, Christopher B. ; Ashurst, W.R.
Author_Institution :
Dept. of Chem. Eng., Auburn Univ., Auburn, AL, USA
Volume :
20
Issue :
5
fYear :
2011
Firstpage :
1065
Lastpage :
1067
Abstract :
In an effort to improve the reliability of microelectromechanical systems (MEMS), silica thin films deposited by chemical vapor deposition were used to encapsulate gold nanoparticle coatings. These composite coatings were shown to provide extremely durable films that significantly reduce the adhesion energy of silicon-based microcantilever beams. The results discussed suggest that encapsulating nanoparticle films with a durable silica thin film may lead to improved MEMS reliability.
Keywords :
gold; micromechanical devices; nanoparticles; reliability; silicon; thin films; MEMS reliability; adhesion energy; chemical vapor deposition; composite coatings; encapsulated nanoparticle films; microcantilever beams; microelectromechanical systems; silica thin films; surface modifications; Adhesives; Micromechanical devices; Rough surfaces; Silicon compounds; Surface roughness; Surface topography; Surface treatment; Microelectromechanical systems (MEMS); nanoparticles; stiction; surface roughness; thin films;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2011.2162494
Filename :
5986667
Link To Document :
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