DocumentCode
1299471
Title
Silica-Encapsulated Nanoparticle Films as Surface Modifications for MEMS
Author
Hurst, Kendall M. ; Ansari, Nayeem ; Roberts, Christopher B. ; Ashurst, W.R.
Author_Institution
Dept. of Chem. Eng., Auburn Univ., Auburn, AL, USA
Volume
20
Issue
5
fYear
2011
Firstpage
1065
Lastpage
1067
Abstract
In an effort to improve the reliability of microelectromechanical systems (MEMS), silica thin films deposited by chemical vapor deposition were used to encapsulate gold nanoparticle coatings. These composite coatings were shown to provide extremely durable films that significantly reduce the adhesion energy of silicon-based microcantilever beams. The results discussed suggest that encapsulating nanoparticle films with a durable silica thin film may lead to improved MEMS reliability.
Keywords
gold; micromechanical devices; nanoparticles; reliability; silicon; thin films; MEMS reliability; adhesion energy; chemical vapor deposition; composite coatings; encapsulated nanoparticle films; microcantilever beams; microelectromechanical systems; silica thin films; surface modifications; Adhesives; Micromechanical devices; Rough surfaces; Silicon compounds; Surface roughness; Surface topography; Surface treatment; Microelectromechanical systems (MEMS); nanoparticles; stiction; surface roughness; thin films;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2011.2162494
Filename
5986667
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