DocumentCode :
1299561
Title :
Current induced degradation in GaAs HBT´s
Author :
Adlerstein, Michael G. ; Gering, Joseph M.
Author_Institution :
Raytheon Adv. Device Center, Andover, MA, USA
Volume :
47
Issue :
2
fYear :
2000
fDate :
2/1/2000 12:00:00 AM
Firstpage :
434
Lastpage :
439
Abstract :
A physical model for observed current gain degradation in GaAs heterojunction bipolar transistors (HBT´s) is suggested in terms of a parameterized mathematical description of accumulating junction damage. The model and measurement suggest a positive correlation between high initial values of DC current gain and longer time to failure. Statistical analysis of accelerated stress failure data at 10 kA/cm2 for InGaP-GaAs HBT´s was conducted. The result shows projected median time to failure (MTTF) of more than 108 h at a junction temperature of 100°C. The standard deviation is 0.6 and the activation energy is 1.5 eV
Keywords :
III-V semiconductors; failure analysis; gallium arsenide; heterojunction bipolar transistors; semiconductor device models; semiconductor device reliability; statistical analysis; 100 C; 1E8 hr; GaAs HBT; InGaP-GaAs; MTTF; accelerated stress failure data; current gain degradation; current induced degradation; damage accumulation model; heterojunction bipolar transistors; junction damage; median time to failure; physical model; statistical analysis; stress tests; Acceleration; Current measurement; Degradation; Gain measurement; Gallium arsenide; Heterojunction bipolar transistors; Mathematical model; Statistical analysis; Stress; Time measurement;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.822291
Filename :
822291
Link To Document :
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