DocumentCode
1300175
Title
Birefringence free planar optical waveguide made by flame hydrolysis deposition (FHD) through tailoring of the overcladding
Author
Kilian, Anton ; Kirchof, J. ; Przyrembel, G. ; Wischmann, Wiltraud
Author_Institution
Inst. fur Phys. Hochtechnol. e.V., Jena, Germany
Volume
18
Issue
2
fYear
2000
Firstpage
193
Lastpage
198
Abstract
Stresses developing in a planar waveguide resulting from the different thermal expansion coefficients of the substrate and the three glass layers (buffer, core and cladding) were analyzed using a finite element method. It can be shown that mainly the thermal expansion of the overcladding determines the birefringence in the finished waveguide. Based on that result, recipes for an overcladding made with the flame-hydrolysis-deposit ion (FHD)-process were devised. We demonstrate the absence of birefringence in a commercial waveguide layer overclad with this glass. The high doping levels required for the cladding to have a thermal expansion coefficient sufficient for this raises concerns about the moisture sensitivity of such a glass. We examined the depth dependent composition of the glass using WD-ESCA (wavelength dispersive electron microprobe) and show, that at the surface a layer depleted of dopants is formed during the high temperature sintering process, This layer can serve as a protective coating to isolate the underlying, higher doped layer from the effects of moisture. Analysis of the stresses shows that this does not effect the birefringence behavior of the waveguide.
Keywords
birefringence; chemical vapour deposition; claddings; electron microscopy; optical communication equipment; optical planar waveguides; telecommunication network routing; thermal expansion; birefringence; birefringence free planar optical waveguide; commercial waveguide layer; finite element method; flame hydrolysis deposition; flame-hydrolysis-deposit ion process; glass layers; glass overcladding; high doping levels; high temperature sintering process; moisture sensitivity; overcladding tailoring; thermal expansion coefficient; thermal expansion coefficients; wavelength dispersive electron microprobe; Birefringence; Fires; Glass; Moisture; Optical buffering; Optical planar waveguides; Optical waveguides; Planar waveguides; Thermal expansion; Thermal stresses;
fLanguage
English
Journal_Title
Lightwave Technology, Journal of
Publisher
ieee
ISSN
0733-8724
Type
jour
DOI
10.1109/50.822792
Filename
822792
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