• DocumentCode
    1300993
  • Title

    The Effect of Deposition Temperature and Work Pressure on Ti–B–C Nanocomposite Coating Prepared by Multitarget Magnetron Cosputtering

  • Author

    Liu, M.Y. ; Yan, J.Y. ; Zhang, S. ; Dong, L. ; Cao, M. ; Deng, X.Y. ; Li, D.J.

  • Author_Institution
    Coll. of Phys. & Electron. Inf. Sci., Tianjin Normal Univ., Tianjin, China
  • Volume
    39
  • Issue
    11
  • fYear
    2011
  • Firstpage
    3115
  • Lastpage
    3119
  • Abstract
    Ternary Ti-B-C nanocomposite coatings were synthesized on a Si(100) wafer and stainless steel substrates from Ti and B4C targets, respectively, by multitarget magnetron cosputtering. Extensive measurements were taken to investigate the influences of deposition temperature and work pressure on microstructure, hardness, elastic modulus, residual stress, friction coefficient, and adhesion strength. The maximum hardness of 42 GPa occurred at the deposition temperature of 400°C and work pressure of 0.5 Pa. The hardest coating also showed the lowest residual stress and the highest critical load. These enhancement effects should be related to nanocrystalline structure formation.
  • Keywords
    adhesion; boron compounds; elastic moduli; elasticity; friction; hardness; internal stresses; nanocomposites; nanofabrication; sputter deposition; sputtered coatings; titanium compounds; Si; Si(100) wafer; TiBC; adhesion strength; deposition temperature effect; elastic modulus; friction coefficient; hardness; microstructure; multitarget magnetron cosputtering; nanocrystalline structure formation; pressure 0.5 Pa; residual stress; stainless steel substrates; temperature 400 degC; ternary nanocomposite coatings; work pressure; Amorphous magnetic materials; Chemicals; Coatings; Friction; Plasma temperature; Residual stresses; Substrates; Hardness; Ti–B–C coating; multitarget magnetron cosputtering; nanocomposite coating;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2011.2162081
  • Filename
    5989870