DocumentCode
1301018
Title
Origin of the Flatband-Voltage Roll-Off Phenomenon in Metal/High-
Gate Stacks
Author
Bersuker, Gennadi ; Park, Chang Seo ; Wen, Huang-Chun ; Choi, K. ; Price, Jimmy ; Lysaght, Patrick ; Tseng, Hsing-Huang ; Sharia, O. ; Demkov, Alex ; Ryan, Jason T. ; Lenahan, P.
Author_Institution
SEMATECH, Austin, TX, USA
Volume
57
Issue
9
fYear
2010
Firstpage
2047
Lastpage
2056
Abstract
The effect of flatband-voltage reduction [roll-off (R-O)], which limits fabrication options for obtaining the needed band-edge threshold voltage values in transistors with highly scaled metal/high- k dielectric gate stacks, is discussed. The proposed mechanism causing this R-O phenomenon is suggested to be associated with the generation of positively charged oxygen vacancies in the interfacial SiO2 layer next to the Si substrate. The vacancies in the interfacial layer are induced by oxygen outdiffusing into the overlying high-k dielectric. The model is consistent with the variety of observations of R-O dependence on the electrode and substrate type, high-k dielectric composition and thickness, temperature, etc. The model´s predictions were experimentally verified.
Keywords
CMOS integrated circuits; high-k dielectric thin films; silicon compounds; transistors; CMOS technology; Si; SiO2; band-edge threshold voltage values; electrode; flatband-voltage reduction effect; flatband-voltage roll-off phenomenon; high scaled metal-high-k gate stack dielectric; interfacial SiO2 layer; oxygen outdiffusing; transistors; Atomic layer deposition; Dielectrics; Electrodes; High K dielectric materials; Logic gates; Metals; Silicon; Flatband voltage roll-off; high-$k$ dielectrics; metal gate work function;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2010.2051863
Filename
5552226
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