Title :
Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHz
Author :
Hwang, Seunghyun ; Min, Sunghwan ; Swaminathan, Madhavan ; Venkatakrishnan, Venkatesan ; Chan, Hunter ; Liu, Fuhan ; Sundaram, Venky ; Kennedy, Scott ; Baars, Dirk ; Lacroix, Benjamin ; Li, Yuan ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.93-3.48) and low loss tangent (0.0037-0.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.
Keywords :
cavity resonators; low-k dielectric thin films; network analysers; RXP; build up material; cavity resonators; frequency 1 GHz to 110 GHz; low processing temperature; low-loss organic dielectrics; mobile applications; next generation dielectric core; next generation thin low-K dielectrics; surface profiler; vector network analyzer; Cavity resonator; dielectric constant; loss tangent; millimeter-wave; surface roughness;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2009.2023413
