Title :
Evaluating Carbon Nanotube Global Interconnects for Chip Multiprocessor Applications
Author :
Pasricha, Sudeep ; Kurdahi, Fadi J. ; Dutt, Nikil
Author_Institution :
Colorado State Univ., Fort Collins, CO, USA
Abstract :
In ultra-deep submicrometer (UDSM) technologies, the current paradigm of using copper (Cu) interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck. In this paper, we perform a system level evaluation of Carbon Nanotube (CNT) interconnect alternatives that may replace conventional Cu interconnects. Our analysis explores the impact of using CNT global interconnects on the performance and energy consumption of several multi-core chip multiprocessor (CMP) applications. Results from our analysis indicate that with improvements in fabrication technology, CNT-based global interconnects can significantly outperform Cu-based global interconnects.
Keywords :
carbon nanotubes; integrated circuit design; integrated circuit interconnections; microprocessor chips; multiprocessing systems; CNT global interconnects; Cu-based global interconnects; UDSM technology; carbon nanotube global interconnect evaluation; copper interconnects; energy consumption; multicore chip multiprocessor; on-chip global communication; system level evaluation; ultra-deep submicrometer technology; Carbon nanotubes; Conductivity; Copper; Crosstalk; Electromigration; Energy consumption; Global communication; Integrated circuit interconnections; Propagation delay; RLC circuits; Carbon nanotubes; chip multiprocessors; global interconnects; system level design;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2009.2024118
