• DocumentCode
    13021
  • Title

    Dielectric Strength of Laminated Paper and Polymer Materials Under Aging and Tensile Stress at 77 K

  • Author

    Xin Yang ; Wei-Guo Li ; Yu-Yan Guo ; Bin Wei ; Hong-Jie Zhang ; Ming Qiu

  • Author_Institution
    Dept. of Electr. & Electron. Eng., North China Electr. Power Univ., Beijing, China
  • Volume
    23
  • Issue
    1
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    7700306
  • Lastpage
    7700306
  • Abstract
    Among various factors influencing the service life of electrical equipment, the performance of dielectric insulation materials has an important role. Degradation of insulating materials caused by aging is fatal to insulation breakdown. The dielectric sheets of most conventional and high-temperature superconducting electrical equipment are working at tensile status when lapped on the conductor. Therefore, the study of the dielectric characteristic for insulation materials at aging and tensile status is very important to safely operate electrical equipment. In this paper, a special electrode system was designed to measure the breakdown voltages of polypropylene laminated paper, polyimide, and polytetrafluoroethylene sheets at tensile status both in normal environment and liquid nitrogen. Before the breakdown experiment, the specimens of the three materials all endured the aging process of abrupt temperature change. According to the test results and the Weibull plot analysis, the polyimide presents good dielectric strength at aging and tensile status both in normal environment and in liquid nitrogen.
  • Keywords
    Weibull distribution; ageing; electric strength; laminates; paper; polymers; tensile strength; Weibull plot analysis; aging; breakdown voltages; dielectric insulation materials; dielectric strength; electrode system; high-temperature superconducting electrical equipment; insulating material degradation; polyimide; polymer materials; polypropylene laminated paper; polytetrafluoroethylene sheets; temperature 77 K; tensile stress; Aging; Cooling; Electric breakdown; Polyimides; Tensile stress; Aging process; Weibull plot; breakdown strength; tensile status;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/TASC.2012.2232917
  • Filename
    6412814