DocumentCode
1302136
Title
Full Two-Dimensional Markov Chain Analysis of Thermal Soft Errors in Subthreshold Nanoscale CMOS Devices
Author
Jannaty, Pooya ; Sabou, Florian C. ; Bahar, R. Iris ; Mundy, Joseph ; Patterson, William ; Zaslavsky, Alexander
Author_Institution
Dept. of Phys., Brown Univ., Providence, RI, USA
Volume
11
Issue
1
fYear
2011
fDate
3/1/2011 12:00:00 AM
Firstpage
50
Lastpage
59
Abstract
Thermally induced fluctuations in the logic state of a simple flip-flop occur on a timescale that renders them impossible to simulate through Monte Carlo methods. In a previous work, an analytical framework based on Markov chains and queue theory was introduced along with a symbolic solution for a truncated 1-D queue, diagonally connecting the two stable logic states in a two-dimensional (2-D) queue. In this paper, a complete solution for a full 2-D queue is presented, which maps all the possible thermal noise fluctuations of electron populations in flip-flop inverters. The results for the mean time to thermally induced error confirm the estimates given by truncated approximations. This formalism is also capable of computing arbitrary probability moments as well as steady-state distributions and transient behavior of the system. The full 2-D queue can also capture the statistics of other noise sources, like radiation-induced charge generation where the flip-flop can transiently reside in a queue state far from the diagonal connecting the two stable logic states of a flip-flop.
Keywords
CMOS integrated circuits; Markov processes; flip-flops; integrated circuit reliability; queueing theory; thermal noise; 2D Markov chain analysis; 2D queue; flip-flop inverters; queue theory; radiation-induced charge generation; subthreshold nanoscale CMOS devices; thermal noise fluctuations; thermal soft errors; truncated 1-D queue; CMOSFET logic devices; Markov processes; Monte Carlo methods; numerical analysis; reliability;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2010.2069100
Filename
5555957
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