• DocumentCode
    1302173
  • Title

    Influence of Emitter Width and Emitter–Base Distance on the Current Gain in 4H-SiC Power BJTs

  • Author

    Buono, Benedetto ; Ghandi, Reza ; Domeij, Martin ; Malm, Bengt Gunnar ; Zetterling, Carl-Mikael ; Östling, Mikael

  • Author_Institution
    Sch. of Inf. & Commun. Technol., R. Inst. of Technol. (KTH), Stockholm, Sweden
  • Volume
    57
  • Issue
    10
  • fYear
    2010
  • Firstpage
    2664
  • Lastpage
    2670
  • Abstract
    The influence of the emitter-base geometry on the current gain has been investigated by means of measurements and simulations. Particular attention has been placed on the emitter width and on the distance between the emitter edge and the base contact. When the emitter width is decreased from 40 to 8 m, the current gain is reduced by 20%, whereas when the distance between the base contact and the emitter edge is decreased from 5 to 2 m, the current gain is reduced by 10%. Simulations have been used to investigate the reasons for the current gain reduction. The reduction of the emitter width induces two mechanisms of current gain reduction: earlier forward biasing of the base-collector junction and higher recombination in the emitter region. Both mechanisms result from the higher current density flowing under the emitter region. Placing the base contact very close to the emitter edge increases the base current by increasing the gradient of the electron concentration toward the base contact. The effect of increasing the base doping in the extrinsic region has been simulated, and the results demonstrate that the current gain can be improved if a high doping concentration in the range of 5 × 1018 cm-3 is used.
  • Keywords
    power bipolar transistors; silicon compounds; wide band gap semiconductors; 4H-SiC power BJT; SiC; base doping; base-collector junction; current gain reduction; distance 5 mum to 2 mum; electron concentration; emitter width; emitter-base distance; emitter-base geometry; forward biasing; size 40 mum to 8 mum; Current measurement; Doping; Gain measurement; Junctions; Knee; Response surface methodology; Semiconductor process modeling; Bipolar junction transistor (BJT); current gain; emitter width; emitter-base distance; silicon carbide (SiC); simulations;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2010.2061854
  • Filename
    5555963