DocumentCode :
1302180
Title :
A Kink-Effect-Free Poly-Si Thin-Film Transistor With Current and Electric Field Split Structure Design
Author :
Chien, Feng-Tso ; Chen, Yi-Ju
Author_Institution :
Dept. of Electron. Eng., Feng-Chia Univ., Taichung, Taiwan
Volume :
57
Issue :
10
fYear :
2010
Firstpage :
2547
Lastpage :
2555
Abstract :
In this paper, we propose a high-performance kink-effect-free bottom-gated polycrystalline (poly-Si) thin-film transistor with a drain-extended field plate (FP) structure. The extended-drain FP can distribute the electric field to the channel near the drain area and, particularly, can change the electron current path. The altered current path leads to a high current density and high electric field split structure that reduces the impact ionization at the drain area. Our experimental results show that the on-current of the proposed device is higher than that of the conventional structure, and the kink effect as well as the leakage current is simultaneously improved. Moreover, the device stability, such as threshold voltage shift and transconductance degradation under a high gate bias, is enhanced by the proposed drain-extended FP design. The current and electric field split structure is also beneficial in scaling down the device size for a better performance.
Keywords :
elemental semiconductors; impact ionisation; leakage currents; silicon; thin film transistors; Si; current density; current field split structure design; drain area; drain-extended FP structure; drain-extended field plate structure; electric field split structure design; electron current path; impact ionization; kink-effect-free polycrystalline thin film transistor; leakage current; threshold voltage shift; transconductance degradation; Charge carrier processes; Current density; Impact ionization; Intellectual property; Logic gates; Passivation; Thin film transistors; Field plate (FP); impact ionization; kink effect; thin-film transistor (TFT);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2010.2063290
Filename :
5555964
Link To Document :
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