• DocumentCode
    1302630
  • Title

    Microstructure and thermal stability of advanced longitudinal media

  • Author

    Doerner, Mary F. ; Tang, Kai ; Arnoldussen, Tom ; Zeng, Hao ; Toney, Michael F. ; Weller, Dieter

  • Author_Institution
    Storage Syst. Div., IBM Corp., San Jose, CA, USA
  • Volume
    36
  • Issue
    1
  • fYear
    2000
  • Firstpage
    43
  • Lastpage
    47
  • Abstract
    Thermal stability will ultimately limit the maximum areal density achievable with conventional longitudinal recording. The key aspects of the media microstructure contributing to thermal stability are the grain size and grain size distribution, alloy composition, alloy segregation, lattice defects and strain. Grain size distributions are created by the random nucleation processes occurring during media deposition. For media on glass substrates, c-axis in-plane preferred orientation can be achieved with either Co (112~0) or (101~0) planes parallel to the substrate surface. Improved squareness, S, is observed with the (112~0) orientation due to stronger crystallographic texture, however, larger changes in coercivity with decreasing magnetic layer thickness are observed compared to (101~0). Continued increases in areal density will require tighter grain size distributions and improved microstructural control of very thin magnetic layers.
  • Keywords
    cobalt alloys; coercive force; grain size; magnetic recording; texture; thermal stability; Co alloy; alloy composition; alloy segregation; areal density; coercivity; crystallographic texture; glass substrate; grain size; grain size distribution; lattice defects; longitudinal recording medium; magnetic layer; microstructure; preferred orientation; random nucleation; squareness; strain; thermal stability; Capacitive sensors; Coercive force; Crystallography; Glass; Grain size; Lattices; Microstructure; Random media; Size control; Thermal stability;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.824423
  • Filename
    824423