DocumentCode :
1304414
Title :
Reliability-Enhancement and Self-Repair Schemes for SRAMs With Static and Dynamic Faults
Author :
Li, Jin-Fu ; Tseng, Tsu-Wei ; Hou, Chih-Sheng
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
Volume :
18
Issue :
9
fYear :
2010
Firstpage :
1361
Lastpage :
1366
Abstract :
This paper proposes a simple method for enhancing the reliability of static random access memories (SRAMs) with hard-to-detect resistive-open defects. The method prevents a SRAM from executing successive multiple read operations on the same position, such that the hard-to-detect defects cannot manifest as functional faults. This can prolong the lifetime of the SRAM with latent hard-to-detect defects. Experimental results show that the proposed reliability-enhancement circuit (REC) can effectively improve the reliability of the SRAMs without incurring delay penalty and with 0.07% additional area cost for an 8192 × 64-bit SRAM. By integrating the REC with the SRAM, a BISR scheme is proposed to boost 6%-10% increment of repair rate compared with the BISR without the REC. Also, the area cost of the BISR is low-only about 2% for an 8192 × 64-bit SRAM.
Keywords :
SRAM chips; integrated circuit reliability; BISR scheme; SRAM; dynamic faults; hard-to-detect resistive-open defects; reliability-enhancement circuit; self-repair schemes; static faults; static random access memories; Built-in self-test; Circuit faults; Costs; Electrical fault detection; Fault detection; Integrated circuit reliability; Random access memory; Read-write memory; SRAM chips; Testing; Random access memories; built-in self-repair; built-in self-test; dynamic faults; march test; reliability; static faults;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2009.2022363
Filename :
5210133
Link To Document :
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