DocumentCode :
1304703
Title :
Thin-film SOI CMOS transistors with p+-polysilicon gates
Author :
Davis, John R. ; Armstrong, G.A. ; Thomas, N.J. ; Doyle, Aidan
Author_Institution :
British Telecom Res. Lab., Ipswich, UK
Volume :
38
Issue :
1
fYear :
1991
fDate :
1/1/1991 12:00:00 AM
Firstpage :
32
Lastpage :
38
Abstract :
A comparison is given of the use of p+-polysilicon and n+-polysilicon as the gate material for high-performance CMOS processes in fully depleted, thin SOI (silicon on insulator) films. Experimental devices on Simox substrates are compared with numerical simulations. It is found that n-channel transistors with p-poly gates require lower channel doping levels than their n-poly counterparts, leading to higher gains and easier control of the threshold voltage. The lower electric fields in the p-poly transistor also result in improved drain breakdown characteristics. Control of the subthreshold and punch-through characteristics of the p-poly device requires the use of very thin films when there is significant fixed positive charge at the interface with the buried oxide
Keywords :
CMOS integrated circuits; insulated gate field effect transistors; semiconductor-insulator boundaries; thin film transistors; Si-SiO2; Simox substrates; bipolar snapback; buried oxide; channel doping levels; drain breakdown characteristics; electric fields; fixed positive charge; gains; n-channel transistors; numerical simulations; p+-polysilicon gates; punch-through characteristics; subthreshold characteristics; thin film SOI CMOS transistors; threshold voltage control; CMOS process; Doping; Electric breakdown; Numerical simulation; Semiconductor films; Silicon on insulator technology; Substrates; Thin film transistors; Threshold voltage; Voltage control;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.65733
Filename :
65733
Link To Document :
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